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Samsung Electronics boosts partnership with ZEISS Group in chip production to enhance yields and performance in next-gen memory chips, announced the electronics giant on April 28.

Samsung aims to enhance efficiency and competitiveness in chip business through the tie-up. Samsung Electronics Executive Chairman Lee Jae-yong took a business trip to the headquarters of ZEISS in Germany to solidify their technological ties in chip production.

ZEISS Group is also set to expand its presence in the Korean market with an investment plan to build its research and development center here.  The investment, valued at 48 billion won (approximately $34.8 million), is set to continue through 2026 and is anticipated to strengthen their bilateral alliance, according to Samsung.

Samsung to mass-produce 10nm-class DRAM by year-end with EUV tech. Lee to meet clients in Europe to explore growth in AI chip market. 

Samsung Electronics is seeking to expand its presence in not just memory, but non-memory chip areas — such as the image sensors and neural processing units (NPU) — in a bid to reduce its heavy reliance on the memory chip business.

Editor：Lulu

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