We at E&K Leiterplatten stand out in the market due to our continuous research and technical innovations. Our major asset is the knowledge of our excellently trained and highly motivated staff, which helped us for instance to successfully implement the SMD technology deploying photosensitive solder resists. Instead of a chemical through-connection, we apply the eco-friendly "Shadow" technique. In our electroplating system, we use “pulse plating” to achieve the desired uniform copper coating effect.